发明名称 APPARATUS AND METHOD FOR HOLDING A WAFER
摘要 An apparatus and a method for holding a wafer are provided in this disclosure. The wafer holding apparatus includes: an electrostatic chuck, the electrostatic chuck having a plurality of concentric zones; a plurality of power supply units, each adapted for applying a voltage to one of the zones of the electrostatic chuck independently; and a control unit, adapted for controlling each of the power supply units independently to start or stop applying the voltage to a corresponding zone of the electrostatic chuck. Surface flatness is improved when the wafer is chucked on the wafer holding apparatus according to the disclosure, and the risk of particle contamination can be reduced when the wafer is flattened and gets back into warpage from flatness.
申请公布号 US2013100572(A1) 申请公布日期 2013.04.25
申请号 US201213649576 申请日期 2012.10.11
申请人 SHU EMILY;SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. 发明人 SHU EMILY
分类号 H01L21/683 主分类号 H01L21/683
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