摘要 |
<p>A semiconductor structure and a manufacturing method therefor. The semiconductor structure comprises: a substrate (100); a gate stack, located on the substrate (100); a side wall (240), located on a lateral wall of the gate stack; a source/drain extension region (310), located in the substrate (100) at two sides of the gate stack, and formed through epitaxial growth; and a source/drain region (330), located in the substrate (100) at two sides of the source/drain extension region (310). Because a source/drain extension region with a high doping concentration and a shallow junction depth is formed, performance of the semiconductor structure is effectively improved.</p> |
申请人 |
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES;YIN, HUAXIANG;MA, XIAOLONG;QIN, CHANGLIANG;XU, QIUXIA;CHEN, DAPENG |
发明人 |
YIN, HUAXIANG;MA, XIAOLONG;QIN, CHANGLIANG;XU, QIUXIA;CHEN, DAPENG |