发明名称 SHEET SUBSTRATE, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, ELECTRONIC COMPONENT TESTING METHOD AND ELECTRONIC COMPONENT MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sheet substrate, an electronic component, an electronic apparatus, an electronic component testing method and an electronic component manufacturing method, which avoid interference between electronic elements and facilitate testing in the electronic components which are structured by substrate region by respectively arranging the electronic elements in the substrate regions of the sheet substrate.SOLUTION: A sheet substrate 54 includes a plurality of substrate regions 56 arranged in a matrix, in each of which an integrated circuit 50 is arranged, and a mounting electrode 18A and a mounting electrode 18B are arranged to be electrically connected to each integrated circuit 50. The sheet substrate 54 of the present embodiment includes: first terminals 62A-62C for connecting the mounting electrodes 18A to the substrate regions 56 with respect to each row and in parallel with each other; and second terminals 66A-66C for connecting the mounting electrodes 18B to the substrate regions 56 with respect to each column and in parallel with each other. Any integrated circuit 50 among the integrated circuits 50 which is specified by the selected first terminal 62A-62C and the selected second terminal 66A-66C can be activated.
申请公布号 JP2013239548(A) 申请公布日期 2013.11.28
申请号 JP20120111168 申请日期 2012.05.15
申请人 SEIKO EPSON CORP 发明人 HORIE KYO
分类号 H05K1/02;H01L23/00;H01L23/12;H03B5/32;H05K3/00 主分类号 H05K1/02
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