| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive thermosetting resin composition excellent in flame retardancy, folding resistance, and insulation reliability, and a flexible printed wiring board including a cured product of the photosensitive thermosetting resin composition.SOLUTION: The photosensitive thermosetting resin composition contains (A) a polyimide resin having an imide ring and a carboxyl group, (B) a photobase generator, (C) a thermosetting component, and (D) a flame retardant. The flame retardant (D) is a reactive compound, preferably a compound reactive with the thermosetting component (C), more preferably a phosphorus-containing compound having a phenolic hydroxyl group. |
