EPOXY RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ENCAPSULATING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating an optical semiconductor that is excellent in cure rate, and can give a cured product excellent in optical transparency and difficult to cause yellow discoloration even when left to stand under a high-temperature environment.SOLUTION: The epoxy resin composition comprises (A) to (C) components as given below: (A)component: an epoxy compound component including an epoxy compound produced by oxidizing an unsaturated bond of tetrahydroindene and a glycidyl isocyanurate compound; (B) component: a curing agent; and (C) component: a curing accelerator.