LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF

摘要

Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

主权项

1. A method for fabricating a System-In-Package, comprising:
providing a first package comprising a first leadframe embedded within the first molded package body, the first leadframe having a first leadframe lead exposed through a sidewall of the first molded package body; and mounting a Surface Mount Device (SMD) to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead.