| 摘要 |
本发明提供一种IC插座(10)，其系包括：具有可拆卸地收纳IC封装体(100)之收纳部(20b)的插座本体(20)；一侧端部(30a)为可转动自如地以第1转动轴(X1)轴支撑于插座本体(20)而开关收纳部(20b)，并且另侧端部(30c)的闩锁构件为被卡合片所卡合而保持于关闭状态的插座盖(30)；及安装于插座盖(30)，藉由使以第3转动轴(X3)轴支撑的凸轮旋转来挤压IC封装体(100)之散热构件(40)。插座盖(30)系在关闭状态下，一侧端部(30a)到另侧端部(30c)为包含着：以插座盖(30)与收纳部(20b)相对之方向为板厚方向的金属板片(36)；金属板片(36)系在接受来自第3转动轴(X3)的力之受力部位的附近，具有经弯折加工成平行于第1转动轴(X1)的沟(36a)。; and a latch member of the other side end portion (30c) is engaged with an engaging piece so as to be kept in a closed state. The heat sink member (40) is installed on the socket cover (30) and squeezes an IC package (100) by a rotation of a cam pivotally supported by a third rotation shaft (X3). In a closed state, the socket cover (3) comprises a metal plate (36), covering from a side end portion (30a) to the other side end portion (30c), having a thickness direction where the socket cover (30) is opposite to the accommodation portion (20b). The metal plate (36), in the vicinity of a portion for receiving a force from the third rotation shaft (X3), has a groove (36a) formed parallel to the first rotation shaft (X1) by a bending process. |
