| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin wiring board which has high reliability in electrical insulation and high density wiring; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board comprises a wiring conductor composed of a plated conductor which fills a through hole 5 of an insulation layer 1 and which is coated on a top surface and an undersurface of the insulation layer 1 by a semi-additive method. The plated conductor is composed of a first plated conductor 7 which only fills a central part of the through hole 5 in a vertical direction and a second plated conductor 9 which fills a part in the through hole 5 and outside the first plated conductor 7 and forms the wiring conductor 2 on the top face and the undersurface of the insulation layer 1. The first plated conductor 7 is formed by using a carbon black film 6 which covers an inner wall of the through hole 5 as a base conductor. The second plated conductor 9 is formed by using the carbon black film 6 and an electroless film 8 on the carbon black film 6 as a base conductor at the inner wall of the through hole 5 and using only the electroless plated film 8 as a base conductor at the top face and the undersurface of the insulation layer 1.</p> |
