| 摘要 |
<p>PROBLEM TO BE SOLVED: To inhibit positional deviation of electronic components build-in a wiring board and improve wiring design flexibility of an electronic component build-in wiring board.SOLUTION: An electronic component build-in wiring board includes: a base material 20 made of an insulative material; a first conductor layer 22 formed on a surface of the base material 20; multiple recessed parts or through holes 20a, 20b which are formed on the base material 20; electronic components 23a, 23b disposed in the recessed parts or the through holes 20a, 20b of the base material 20; and an insulation layer formed on the electronic components 23a, 23b, the base material 20, and the first conductor layer 22. At least two recessed parts or the through hole 20a, 20b are formed in one opening part 22b of the first conductor layer 22, in which a conductor pattern 22a is not provided, with the base material 20 used as a partition wall 21.</p> |
