发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition which has appropriate workability as a curable resin composition used in sealing applications, e.g. sealing of on-site formation of a gasket, and desirable thixotropy.SOLUTION: A curable resin composition comprises (A) 100 pts. mass of an acrylic monomer which is 5-18C in principal chain and has a monofunctional chain alkyl skeletal structure, (B) 15-45 pts. mass of a PTFE filler, (C) 0.01-5 pts. mass of photoinitiator and (D) 1-10 pts. mass of a thermoplastic elastomer.
申请公布号 JP2015157912(A) 申请公布日期 2015.09.03
申请号 JP20140033724 申请日期 2014.02.25
申请人 THREE BOND CO LTD 发明人 KAMAKURA HAYATO;NAKAMURA MOEKO
分类号 C08F2/48;C08F2/44;C08F259/08;C08F291/00;C08L21/00;C08L27/18;C08L33/00 主分类号 C08F2/48
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