SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE

摘要

TO PROVIDE A SOLDER PIECE (1A) THAT PREVENTS ITS SURFACE ON WHICH THE SHEAR DROOP PORTION (15A) GENERATED BY THE PUNCHING PROCESS IS FORMED FROM BECOMING A SUCKED SURFACE. THE SOLDER PIECE (1A) IS PROVIDED WITH FOUR SURFACES, NAMELY, A FIRST SURFACE (11), A SECOND SURFACE (12), A THIRD SURFACE (13) AND A FOURTH SURFACE (14), WHICH CAN BE AN SUCKED SURFACE ON THE OCCASION OF HANDLING; A FIFTH SURFACE (15) WHICH IS A SURFACE ON WHICH A SHEAR DROOP PORTION (15A) GENERATED BY THE PUNCHING PROCESS IS FORMED AND A SIXTH SURFACE (16) THAT IS OPPOSITE TO THE FIFTH SURFACE (15). THE SOLDER PIECE (1A) IS PUNCHED OUT IN A DIRECTION SHOWN IN AN ARROW A WITH THE FIRST SURFACE (11), THE SECOND SURFACE (12), THE THIRD SURFACE (13) AND THE FOURTH SURFACE (14) BEING SHARED SURFACES. THIS ENABLES THE FOUR SURFACES THEREOF EXCLUDING FROM SURFACES THEREOF THE FIFTH SURFACE (15) ON WHICH THE SHEAR DROOP PORTION (15A) IS FORMED AND THE SIXTH SURFACE (16) THAT IS OPPOSITE TO THE FIFTH SURFACE (15) TO BE FORMED WITH DESIRED SIZE AND PRECISION. IT IS CONFIGURED SO THAT ANY ONE OF THE FIRST SURFACE (11), THE SECOND SURFACE (12), THE THIRD SURFACE (13) AND THE FOURTH SURFACE (14) BECOMES A SUCKED SURFACE AND THE FIFTH SURFACE (15) ON WHICH THE SHEAR DROOP PORTION (15A) IS FORMED IS PREVENTED FROM BECOMING THE SUCKED SURFACE.