发明名称 METAL CHIP COMPRESSION MOLDING APPARATUS
摘要 <p>Provided is a metal chip compression molding apparatus which uniformly supplies an inputted metal chip to be compression molded through a primary and a secondary stage in one molding apparatus. Moreover, the metal chip compression molding apparatus enables a plurality of compression molding objects to be compressed and discharged at the same time, and comprises: a uniform supply unit uniformly supplying an inputted metal chip to a plurality of supply holes; a plurality of transfer supply units transferring the metal chip supplied from the uniform supply unit to be charged for compression; and a plurality of compression molding units compressing the metal chip charged from the transfer supply units by primary temporary compression and a secondary main compression, simultaneously discharging molding objects compression molded in case of the secondary main compression on a lower portion. Therefore, provided are compression molding objects having uniform density to secure high reliability, and simultaneously maximizing an efficiency of compression molding by the compression molding objects which are formed at the same time.</p>
申请公布号 KR101547253(B1) 申请公布日期 2015.08.26
申请号 KR20140036922 申请日期 2014.03.28
申请人 KOREA AEROSPACE INDUSTRIES, LTD. 发明人 KIM, SUNG YEOL
分类号 B30B9/32 主分类号 B30B9/32
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