SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a semiconductor chip, a plurality of passive electronic components, a substrate, a main lead, and a sealing resin. The semiconductor chip includes a functional circuit. The plurality of passive electronic components assist a function of the semiconductor chip. The substrate has a principal surface and a reverse surface that face in opposite directions to each other, and the semiconductor chip and the plurality of passive electronic components are mounted on the principal surface. The main lead includes an island portion that is joined to the reverse surface of the substrate, and a terminal portion that is offset in a predetermined direction with respect to the island portion. The sealing resin covers the semiconductor chip, the substrate, and the island portion of the main lead.

主权项

1. A semiconductor device comprising:
a semiconductor chip including a functional circuit; a plurality of passive electronic components that assist a function of the semiconductor chip; a substrate including a principal surface and a reverse surface that face in opposite directions to each other, the semiconductor chip and the plurality of passive electronic components being mounted on the principal surface; a main lead including an island portion joined to the reverse surface of the substrate, and a terminal portion located on one side in a first direction relative to the island portion; and a sealing resin that covers the semiconductor chip, the substrate, and the island portion of the main lead.