发明名称 |
MANUFACTURABLE LASER DIODE |
摘要 |
A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch. |
申请公布号 |
US2015229107(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201414312427 |
申请日期 |
2014.06.23 |
申请人 |
Soraa Laser Diode, Inc. |
发明人 |
McLaurin Melvin;Sztein Alexander;Hsu Po Shan;Goutain Eric;Steigerwald Dan;Raring James W. |
分类号 |
H01S5/40;H01S5/30;H01S5/02 |
主分类号 |
H01S5/40 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a laser diode device, the method comprising:
providing a substrate having a surface region; forming an epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region; patterning the epitaxial material to form a plurality of dice, each of the dice corresponding to at least one laser diode device; transferring each of the plurality of dice to one or more carrier substrates; processing at least one of the plurality of dice on at least one of the carrier substrates; and packaging the die with the substrate to configure a module device. |
地址 |
Goleta CA US |