发明名称 Butted SOI junction isolation structures and devices and method of fabrication
摘要 A structure, a FET, a method of making the structure and of making the FET. The structure including: a silicon layer on a buried oxide (BOX) layer of a silicon-on-insulator substrate; a trench in the silicon layer extending from a top surface of the silicon layer into the silicon layer, the trench not extending to the BOX layer, a doped region in the silicon layer between and abutting the BOX layer and a bottom of the trench, the first doped region doped to a first dopant concentration; a first epitaxial layer, doped to a second dopant concentration, in a bottom of the trench; a second epitaxial layer, doped to a third dopant concentration, on the first epitaxial layer in the trench; and wherein the third dopant concentration is greater than the first and second dopant concentrations and the first dopant concentration is greater than the second dopant concentration.
申请公布号 US9105718(B2) 申请公布日期 2015.08.11
申请号 US201414224384 申请日期 2014.03.25
申请人 International Business Machines Corporation 发明人 Johnson Jeffrey B.;Narasimha Shreesh;Nayfeh Hasan M.;Ontalus Viorel;Robison Robert R.
分类号 H01L29/78;H01L21/762;H01L21/84;H01L27/12 主分类号 H01L29/78
代理机构 Schmeiser, Olsen & Watts 代理人 Schmeiser, Olsen & Watts ;LeStrange Michael
主权项 1. A structure, comprising: a silicon layer on a buried oxide layer of a silicon-on-insulator substrate; a first gate electrode of a field effect transistor on a top surface of a gate dielectric layer formed on a top surface of said silicon layer and a second gate of a second field effect transistor on said top surface of said gate dielectric layer; a trench in said silicon layer between said first and second gate electrodes, said trench extending from a top surface of said silicon layer into said silicon layer, said trench not extending to said buried oxide layer; a doped region in said silicon layer between and abutting said buried oxide layer and a bottom of said trench, said doped region doped to a first dopant concentration, said doped region and said silicon layer doped opposite dopant types; a first epitaxial layer, doped to a second dopant concentration, in a bottom of said trench, said first epitaxial layer partially filling said trench; a second epitaxial layer, doped to a third dopant concentration, on said first epitaxial layer in said trench; and wherein said third dopant concentration is greater than said first and second dopant concentrations and said first dopant concentration is greater than said second dopant concentration.
地址 Armonk NY US