| 发明名称 |
EMBEDDED BOARD, PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer. |
| 申请公布号 |
US2015223341(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514597795 |
申请日期 |
2015.01.15 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Sang Hoon;MIN Tae Hong;KO Young Gwan;KIM Hye Jin;CHO Suk Hyeon;KWON Chil Woo;LEE Jung Han |
| 分类号 |
H05K1/18;H05K3/30;H05K3/00;H05K3/02;H05K1/11;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An embedded board, comprising:
a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; a device disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a via formed in the build-up insulating layer. |
| 地址 |
Suwon KR |
