发明名称 |
Blanket EPI super steep retrograde well formation without Si recess |
摘要 |
A method of forming SSRW FETs with controlled step height between a field oxide and epitaxially grown silicon and the resulting devices are provided. Embodiments include providing a SiN layer on a substrate, forming first, second, and third spaced STI regions of field oxide through the SiN layer and into the substrate, removing a top portion of the field oxide for each STI region by a controlled deglaze, removing the SiN layer, forming an n-type region in the substrate between the first and second STI regions and a p-type region in the substrate between the second and third STI regions, and epitaxially growing a Si based layer on the substrate over the n-type and p-type regions. |
申请公布号 |
US9099525(B2) |
申请公布日期 |
2015.08.04 |
申请号 |
US201213729207 |
申请日期 |
2012.12.28 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Kang Laegu;Vakada Vara Govindeswara Reddy;Ganz Michael P.;Qi Yi;Khanna Puneet;Vemula Sri Charan;Samavedam Srikanth |
分类号 |
H01L21/762;H01L29/66;H01L29/10;H01L21/8238;H01L29/165 |
主分类号 |
H01L21/762 |
代理机构 |
Ditthavong & Steiner, P.C. |
代理人 |
Ditthavong & Steiner, P.C. |
主权项 |
1. A method comprising:
providing a sacrificial oxide layer on a substrate; providing a silicon nitride (SiN) layer above the sacrificial oxide layer; forming first, second, and third spaced shallow trench isolation (STI) regions of field oxide through the SiN layer and into the substrate; removing a top portion of the field oxide for each STI region by a controlled deglaze; removing the SiN layer; forming an n-type region in the substrate between the first and second STI regions and a p-type region in the substrate between the second and third STI regions; removing the sacrificial oxide layer by precleaning; removing 4 nanometers (nm) of field oxide from each STI region during the precleaning; and epitaxially growing, after the precleaning, a silicon (Si) based layer on the substrate over the n-type and the p-type regions. |
地址 |
Grand Cayman KY |