CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF

摘要

A preparation method of a bonding sheet used for comprising a circuit substrate. The method comprises using a pretreatment adhesive solution provided with a dielectric constant that is equal or close to a dielectric constant of glass fiber cloth that is used to pretreat the glass fiber cloth. Also provided are the bonding sheet and the circuit substrate that are prepared using the method. The preparation method of the circuit board does not require device reconstruction or adjustment, a cost is lower, and a difference between dielectric constants of the prepared circuit substrate in a longitudinal direction and a latitudinal direction is smaller, effectively solving a signal delay problem.