| 发明名称 | Multilayer ceramic electronic component and fabrication method thereof | ||
| 摘要 | A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied. | ||
| 申请公布号 | US9087644(B2) | 申请公布日期 | 2015.07.21 |
| 申请号 | US201213620663 | 申请日期 | 2012.09.14 |
| 申请人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 发明人 | Jeon Byung Jun;Lee Kyu Ha;Gu Hyun Hee;Kim Chang Hoon;Park Myung Jun |
| 分类号 | H01G4/232;H01G4/30;H01G4/228;H01G4/12 | 主分类号 | H01G4/232 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A multilayer ceramic electronic component comprising: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed of a conductive paste formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied. | ||
| 地址 | Suwon, Gyunggi-Do KR | ||