发明名称 APPARATUS FOR TREATING SUBSTRATE
摘要 <p>Provided are an apparatus and a method for heating a substrate. The apparatus for treating a substrate comprises: a temperature measurement member measuring the temperature of each heating zone; a controller receiving measurement data measured from the temperature measurement member and correcting the temperature of the heating unit; a measurement plate in which sensors measuring each temperature of the heating zones are installed; and a transmitter installed on the measurement plate and transmitting the measurement data based on the temperature measured from the sensors wirelessly. The controller comprises: a receiver receiving the measurement data from the transmitter; and a data processing unit analyzing the measurement data provided to the receiver, and calculating a set value so that a heater can heat the heating zones to the set temperature. As the data measured by the measurement plate are transmitted wirelessly, a process for repeatedly carrying in and taking the measurement plate out of facilities for treating the substrate.</p>
申请公布号 KR20150076810(A) 申请公布日期 2015.07.07
申请号 KR20130165420 申请日期 2013.12.27
申请人 SEMES CO., LTD. 发明人 SEO, JONG SEOK
分类号 H01L21/683;H01L21/66 主分类号 H01L21/683
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