| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a composite sheet for forming a resin film capable of preventing transfer of a component constituting a film for forming the resin film to an adhesive layer, which is an adhesive sheet for dicing/die bonding for simplifying a pick-up step or a bonding step after being stuck on a wafer for producing a semiconductor chip.SOLUTION: A composite sheet 10 for forming a resin film has an adhesive sheet having an adhesive layer 2 on a substrate 1, and a film 4 for forming the resin film provided on the adhesive layer. The adhesive layer contains a polyisobutylene rubber-based resin.</p> |
