| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated sheet for semiconductor, capable of easily forming a semiconductor chip with adhesive layer which includes an adhesive layer having a shape suitable for mounting of a semiconductor chip. <P>SOLUTION: The laminated sheet 100 for semiconductor includes: a pressure-sensitive adhesive film 120 and an adhesive film 110 adhered to the pressure-sensitive adhesive film 120. The adhesive film 110 contains a thermoplastic resin having an imido framework, a photo-curable resin and a photo-radical generator, and the pressure-sensitive adhesive film 120 contains an acrylic copolymer and a photo-radical generator. The glass transition temperature of the thermoplastic resin is 10°C or higher, and the glass transition temperature of the acrylic copolymer is 0°C or lower. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
