Mold chase for integrated circuit package assembly and associated techniques and configurations

摘要

Embodiments of the present disclosure are directed towards a mold chase for integrated circuit package assembly and associated techniques and configurations. In one embodiment, a method includes receiving a package substrate, the package substrate including a first die mounted on the package substrate by a plurality of first interconnect structures, and a plurality of second interconnect structures disposed on the package substrate and configured to route electrical signals of a second die, protecting a top surface of individual interconnect structures of the plurality of second interconnect structures from deposition of a mold material, and depositing the mold material on the package substrate between the individual interconnect structures of the plurality of second interconnect structures. Other embodiments may be described and/or claimed.

主权项

1. Fabrication equipment comprising:
a first portion configured to receive a package substrate for deposition of a mold material a second portion coupled with the first portion; a pin plate coupled with the second portion, the pin plate having a plurality of pins coupled to the pin plate and configured to correspond with a plurality of interconnect structures disposed on the package substrate, wherein the pin plate is configured to apply a force between individual pins of the plurality of pins and a top surface of individual interconnect structures of the plurality of interconnect structures to protect the top surface of the individual interconnect structures during deposition of the mold material; and a die compression plate coupled to the second portion and disposed between the pin plate and the first portion, the die compression plate having a compressive material that is configured to press against and protect a surface of the first die during deposition of the mold material.