发明名称 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To make it hard to detach a metal plate from a base material.SOLUTION: A wiring board comprises: a first metal plate on a surface of an insulating substrate; a second metal plate 31 on a rear face of the insulating substrate; an interlayer connection part for connecting the first metal plate and the second metal plate; a base material through hole which is provided in the insulating substrate and pierces the insulating substrate in a thickness direction; a through hole which is provided in the first metal plate opposite to the base material through hole and pierces the first metal plate in a thickness direction; a plurality of testing through holes 33 which are provided in the second metal plate 31; and a salient 32 provided on the second metal plate 31 in a region surrounded by the plurality of testing through holes 33. When the salient 32 and the testing through holes 33 are formed on the second metal plate 31, after the testing through holes 33 are formed, the salient 32 is formed by press work by a mold 50 for the hole.</p>
申请公布号 JP2015119098(A) 申请公布日期 2015.06.25
申请号 JP20130262696 申请日期 2013.12.19
申请人 TOYOTA INDUSTRIES CORP 发明人 GUNJI TAKAHIRO;OZAKI KIMINORI
分类号 H05K3/40;H05K1/11 主分类号 H05K3/40
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