| 摘要 |
PROBLEM TO BE SOLVED: To easily detect the deterioration of a bonding wire by enlarging a fluctuation range between the voltage at the normal time and the voltage at the degradation time. ! SOLUTION: In a device 1 for detecting the deterioration of a bonding wire, a bonding wire 7T for an emitter signal for connecting an emitter electrode Eb of a substrate 3 and an emitter electrode E of a chip 5 is connected to an electrode T for inspection, a Kelvin emitter electrode KE of the chip 5 is connected to the Kelvin emitter electrode KEb of the substrate 3, and the voltage between the Kelvin emitter electrode KEb and the electrode T for inspection is detected, then the deterioration of a bonding wire 7 for the emitter signal is detected. ! COPYRIGHT: (C)2015,JPO&INPIT |
