发明名称 |
MULTI-PIECE WIRING BOARD AND WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which improves electric insulation between exposed parts of a connection conductor that connects wiring conductors with each other, and the wiring conductor in a boundary of a wiring board region.SOLUTION: The multi-piece wiring board includes: a mother board 1 in which a plurality of insulation layers 3 are laminated and a plurality of wiring board regions 2 are arrayed; a plurality of wiring conductors which are arrayed along a boundary of the wiring board regions 2 between first layers 3a of the insulation layers 3 and provided over a boundary of the wiring board regions 2 between the neighboring wiring board regions 2 and include exposed parts covered by plating layers in the boundary; the wiring conductors which are provided between second layers 3b different from the first layers 3a over the boundary of the wiring board regions between the neighboring wiring board regions 2 and neighboring to each other in an array direction of the wiring conductors; and a plurality of connection conductors which are alternately connected in one of the neighboring wiring board regions and the other wiring board region. |
申请公布号 |
JP2015115489(A) |
申请公布日期 |
2015.06.22 |
申请号 |
JP20130257081 |
申请日期 |
2013.12.12 |
申请人 |
KYOCERA CORP |
发明人 |
YOSHIMOTO TAKESHI;TAKESHITA MAKOTO;MORISHIGE SEI |
分类号 |
H05K1/02;H05K1/11;H05K3/00;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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