发明名称 MULTI-PIECE WIRING BOARD AND WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which improves electric insulation between exposed parts of a connection conductor that connects wiring conductors with each other, and the wiring conductor in a boundary of a wiring board region.SOLUTION: The multi-piece wiring board includes: a mother board 1 in which a plurality of insulation layers 3 are laminated and a plurality of wiring board regions 2 are arrayed; a plurality of wiring conductors which are arrayed along a boundary of the wiring board regions 2 between first layers 3a of the insulation layers 3 and provided over a boundary of the wiring board regions 2 between the neighboring wiring board regions 2 and include exposed parts covered by plating layers in the boundary; the wiring conductors which are provided between second layers 3b different from the first layers 3a over the boundary of the wiring board regions between the neighboring wiring board regions 2 and neighboring to each other in an array direction of the wiring conductors; and a plurality of connection conductors which are alternately connected in one of the neighboring wiring board regions and the other wiring board region.
申请公布号 JP2015115489(A) 申请公布日期 2015.06.22
申请号 JP20130257081 申请日期 2013.12.12
申请人 KYOCERA CORP 发明人 YOSHIMOTO TAKESHI;TAKESHITA MAKOTO;MORISHIGE SEI
分类号 H05K1/02;H05K1/11;H05K3/00;H05K3/46 主分类号 H05K1/02
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