MODULAR JACK HAVING POE LEADS SOLDERING ON AN OBLIQUE INNER PCB

摘要

A modular jack includes an insulative housing, an oblique inner PCB mounted on the insulative housing, a number of mating contacts soldered to the top edge portion of the inner PCB, a number of footer pins soldered to the bottom edge portion of the inner PCB, and a number of POE leads soldered to the top edge portion. The contacts, footer pins, and POE leads are retained on the same piece insulative housing, thus omitting requirement of an insulative carrier and a process of assembling the footer pins and POE leads to the insulative carrier. Each of the contacts, footer pins, and POE leads has a connecting section extending along a same direction in order for the tail sections to be soldered on a same top face of the inner PCB by a one-time soldering process.

主权项

1. A modular jack comprising:
an insulative housing including a middle wall cooperating with opposite top and bottom walls and opposite two side walls to commonly define a front mating port, the middle wall defining a plurality of grooves; a mounting port formed behind the middle wall opposite to the mating port, the mounting port communicating with the mating port through the plurality of grooves; an inner PCB (printed circuit board) obliquely assembled to mounting port, the inner PCB defining an upper edge region distal from the bottom wall while proximate to the middle wall and a bottom edge region distal from the middle wall while proximate to the bottom wall; a plurality of contacts each including a mating section exposed within the mating port to mate with a modular plug, a first retention section retained to the insulative housing, and a first tail section connecting with the upper edge region; a plurality of footer pins each including a second retention section retained to the insulative housing, a leg section downwardly extending below the bottom wall, and a second tail section connected to the bottom edge region; and a plurality of power-over-ethernet (POE) leads retained by the insulative housing, each of said POE leads having a third tail section connected to the inner PCB and a mounting section downwardly extending beyond the bottom wall; wherein said inner PCB defines a plurality of conductive through-holes, the first, second, and third tail sections are inserted in the plurality of conductive through-holes along a direction substantially perpendicular to the inner PCB, and the first, second, and third tail sections are soldered on a same face of the inner PCB.