Curved wafer processing on method and apparatus

摘要

An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

主权项

1. A method of forming a semiconductor structure, the method comprising:
providing a substrate; forming a recess in a processing surface of the substrate; curving the processing surface of the substrate; processing the substrate while the processing surface is curved, the processing comprising forming one or more components of a semiconductor element, the one or more components of the semiconductor element comprising a stress-inducing region in the recess; and relaxing the processing surface after the processing.