发明名称 SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a metal powder capable of being used for a conductive paste having a sufficient electric conductivity even when the conductive paste contains a less amount of the metal powder. ! SOLUTION: A silver-coated copper powder comprises: a dendritic projection silver-coated copper powder made by coating, with silver, a dendritic projection copper powder constituted of grains each having a structure having one stem part serving as a main axis and a plurality of branches branched from the stem part; a spinous silver-coated copper powder made by coating, with silver, a spinous projection copper powder constituted of grains each having a structure that a plurality of grains of a dendritic projection copper powder are entangled with each other and coagulated so as not to separate, or a structure having a central part as a core and branches extended from the core radially; and a bar-shaped silver coated-copper powder made by coating, with silver, a bar-shaped copper powder constituted o
申请公布号 JP2015105406(A) 申请公布日期 2015.06.08
申请号 JP20130247729 申请日期 2013.11.29
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 MOTOMURA KOICHI ; KANESHIRO MASAKI ; INOUE KENICHI
分类号 B22F1/02;B22F1/00;B22F9/00;H01B1/00;H01B1/02;H01B1/22;H01B5/00 主分类号 B22F1/02
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