| 摘要 |
PROBLEM TO BE SOLVED: To provide a stress evaluation method and a stress evaluation apparatus capable of accurately evaluating a stress that causes a strain in a semiconductor device or the other structure. ! SOLUTION: A first step of polishing or grinding a structure to form an end face, measuring a surface displacement of the end face, and acquiring a surface displacement image; and a second step of acquiring a structure image for discriminating a profile of constituent elements of the structure on the end face are repeatedly executed. A plurality of surface displacement images obtained by repetition of the first and second steps are reconstructed in three dimensions to generate a three-dimensional elastic deformation image, and a plurality of structure images are reconstructed in three dimensions to generate a structure model. Subsequently, a stress is virtually applied to a predetermined position of the structure model to calculate an elastic deformation distribution in an evaluation range, the stress |
