| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a grinding method capable of reducing risk that quality degradation or breakage such as surface burning occurs in a wafer. <P>SOLUTION: This grinding method includes: a holding step of holding processing objects 11 by a grinding device including a rotatable chuck table 54, a grinding means to rotatably support grinding wheels 30 including abrasive wheels 32 for grinding the processing objects 11 held to the chuck table, a grinding feed means to subject the grinding means to grinding feed, and an ultrasonic wave generation means to impart ultrasonic vibration to the abrasive wheels 32; a step of actuating the ultrasonic wave generation means while rotating the chuck table 54 to impart the ultrasonic vibration to the abrasive wheels 32, and making the rotating abrasive wheels 32 cut in the processing objects 11 by subjecting the grinding means to grinding feed by the grinding feed means; and a grinding step of grinding the processing objects 11 by stopping the ultrasonic wave generation means after executing the cutting-in step and subjecting the grinding means to grinding feed by the grinding feed means. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
