可Ｂ阶段化且可无需固化之晶圆背面涂覆黏着剂;B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES

摘要

本发明系关于一种具有足够机械及黏着强度，以在不先固化之情况下耐受在介于125℃至210℃之间之温度下之制造操作之黏着剂组合物。简言之，略过在黏晶操作后之固化，且该黏着剂可表现出在通常125℃至210℃温度下之线接合操作期间及在通常170℃至180℃温度下之模塑操作期间不排气及产生空隙。该黏着剂组合物包含(i)低玻璃转化(Tg)丙烯酸酯单体、(ii)双官能丙烯酸酯/环氧基化合物、(iii)苯氧基树脂及(iv)固体环氧树脂。 This invention is an adhesive composition that has sufficient mechanical and adhesive strength to withstand manufacturing operations at temperatures between 125° to 210℃ without first being cured. In brief, the cure after the die attach operation is skipped, and the adhesive can perform without out-gassing and creating voids through the wire bonding operation, at temperatures typically 125° to 210℃, and molding operation, at temperatures typically 170°