发明名称 HOLE FORMATION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology which can make die life longer and enhance inner face precision of a through-hole, in a hole formation method for forming the through-hole in a formed product.SOLUTION: In a preliminary forming process, a cave-in part 26 is formed on one face so as to surround a boss part 11, a projection part 27 is formed on the other face, and a thin wall part 31 is formed between the inner peripheral surface of the cave-in part 26 and the outer peripheral surface of the projection part 27. Next, the thin wall part 31 is ruptured with a punch. Accordingly, shear resistance becomes smaller since the thin wall part has a small thickness related to shearing, so that punching force becomes smaller. A load on punching becomes smaller and service life of the punch becomes longer. As a result, die life can be made longer. Additionally, a rupture surface becomes smaller, so that precision of the inner face of the through-hole can be enhanced.</p>
申请公布号 JP2015098049(A) 申请公布日期 2015.05.28
申请号 JP20130239829 申请日期 2013.11.20
申请人 MUSASHI SEIMITSU IND CO LTD 发明人 MURATA SHINICHI
分类号 B21J5/10;B21J5/02 主分类号 B21J5/10
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