| 摘要 |
PROBLEM TO BE SOLVED: To provide a Bi solder alloy which does not substantially contain Pb, has a solidus line of 265°C or more and a liquidus line of 390°C or less, is excellent in mechanical processing property, mechanical strength, and joint reliability, and is suitable for bonding electronic parts onto a frame substrate having the surface subjected to Ni plating.SOLUTION: A Bi-base solder alloy contains Ag and Al, substantially does not contain Pb, has a Bi content of 80 mass% or more, and has a solidus line of 265°C or more and a liquidus line of 390°C or less of melting point. Therein, Ag content is 0.6 to 18 mass%, Al content is 0.1 to 3 mass% and 1/20 to 1/2 of the Ag content, particles containing metallic compounds of Ag and Al are dispersed in the solder alloy, and, further, at least one kind of Sn and Zn is contained by 0.01 to 3 mass% in the solder alloy. |
