发明名称 |
METHOD OF MANUFACTURING ORGANIC INSULATION FILM HAVING THROUGH HOLE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic insulation film of a thin film having a fine through-hole without requiring a special shape and processing for a printing plate and also without requiring peeling-off after filling the printing plate with ink.SOLUTION: Disclosed is a method of manufacturing an organic insulation film having a through hole having the steps of: forming the organic insulation film whose value of the ratio between the wall thickness of the organic insulation film and the pillar height is less than 1.0 by coating ink which contains an organic insulation film material and whose viscosity is 5.5 m Pas or less on the printing plate having the pillar; and printing the organic insulation film on the base material.</p> |
申请公布号 |
JP2015099867(A) |
申请公布日期 |
2015.05.28 |
申请号 |
JP20130239641 |
申请日期 |
2013.11.20 |
申请人 |
SUMITOMO CHEMICAL CO LTD |
发明人 |
MATSUMURO TOMONORI |
分类号 |
H01L21/768;H01L21/312;H01L21/336;H01L23/532;H01L29/786 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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