| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip capable of manufacturing a chip on whose rear face side a protection film is formed, by using a wafer division method of a stealth dicing system.SOLUTION: A method includes: a protection member adhesion step of adhering a protection member 2 onto a surface 1A of a semiconductor wafer 1; an altered layer formation step of irradiating the semiconductor wafer 1 with a laser beam having permeability along a division schedule line from a rear face 1B side of the semiconductor wafer 1 on which the protection member 2 is adhered to form an altered layer; a polishing step of polishing the rear face 1B of the semiconductor wafer 1 on which the protection member is adhered; a step of forming a thermosetting protection film formation layer 3 on the rear face side of the semiconductor wafer 1; a dicing sheet adhesion step of adhering a dicing sheet 4 on the rear face 1B side of the semiconductor wafer 1 on which the altered layer is formed; a protection member peeling step of peeling out the protection member 2; and a semiconductor wafer division step of dividing the semiconductor wafer into a plurality of chips. |
