发明名称 RESIN COMPOSITION WITH HIGH DIELECTRIC INSULATION PROPERTIES
摘要 Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 10 12 © cm), and for use in electrical power, connnunication devices, and the like. The resin composition with high dielectric insulation properties comprised a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula ABO 3 .
申请公布号 EP2752462(A4) 申请公布日期 2015.05.27
申请号 EP20130743078 申请日期 2013.01.24
申请人 MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC 发明人 MATSUKURA TOSHIHIKO;IIJIMA HIROYOSHI;SHIMAKAWA MASANARI
分类号 C08L101/00;C08K3/22;H01B3/00;H01B3/12;H01B3/40;H01B3/46;H01G4/12 主分类号 C08L101/00
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