发明名称 PRESSURE SENSITIVE ADHESIVE COMPOSITION
摘要 The present invention relates to adhesive compositions, films for protecting conductive laminate, and conductive laminate. In the present invention, provided is a cured material of the adhesive composition, which has an adhesive layer attached to a coating surface like conductive laminate, accordingly protects the surface of the conductive laminate and maintain peeling force regardless of peeling speed after heat treatment for sintering, thereby being used as protective films.
申请公布号 KR20150056492(A) 申请公布日期 2015.05.26
申请号 KR20140159898 申请日期 2014.11.17
申请人 LG CHEM. LTD. 发明人 PARK, YONG SU;LEE, HUI JE;KIM, HYUN CHEOL;KWON, YOON KYUNG;PARK, HYON GYU;KIM, HAK LIM;LEE, DAE HYUCK;JUNG, SA YOUNG
分类号 C09J133/06;C09J7/02;H01B5/14 主分类号 C09J133/06
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