发明名称 |
PRESSURE SENSITIVE ADHESIVE COMPOSITION |
摘要 |
The present invention relates to adhesive compositions, films for protecting conductive laminate, and conductive laminate. In the present invention, provided is a cured material of the adhesive composition, which has an adhesive layer attached to a coating surface like conductive laminate, accordingly protects the surface of the conductive laminate and maintain peeling force regardless of peeling speed after heat treatment for sintering, thereby being used as protective films. |
申请公布号 |
KR20150056492(A) |
申请公布日期 |
2015.05.26 |
申请号 |
KR20140159898 |
申请日期 |
2014.11.17 |
申请人 |
LG CHEM. LTD. |
发明人 |
PARK, YONG SU;LEE, HUI JE;KIM, HYUN CHEOL;KWON, YOON KYUNG;PARK, HYON GYU;KIM, HAK LIM;LEE, DAE HYUCK;JUNG, SA YOUNG |
分类号 |
C09J133/06;C09J7/02;H01B5/14 |
主分类号 |
C09J133/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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