发明名称 Semiconductor memory device and semiconductor device
摘要 A semiconductor memory device includes a writing circuit and a reading circuit. The writing circuit executes a setting action for converting a resistance of a variable resistance element to a low resistance by applying current from one end side to the other end side of a memory cell via the variable resistance element, and a resetting action for converting the resistance to a high resistance by applying current from the other end side to the one end side via the variable resistance element. The reading circuit executes a first reading action for reading a resistance state of the variable resistance element by applying current from one end side to the other end side of the memory cell via the variable resistance element, and a second reading action for reading the resistance state by applying current from the other end side to the one end side via the variable resistance element.
申请公布号 US9042156(B2) 申请公布日期 2015.05.26
申请号 US201213647573 申请日期 2012.10.09
申请人 Sharp Kabushiki Kaisha 发明人 Nakura Mitsuru;Awaya Nobuyoshi;Ishihara Kazuya;Seko Akiyoshi
分类号 G11C11/00;G11C13/00 主分类号 G11C11/00
代理机构 Nixon & Vanderhye, P.C. 代理人 Nixon & Vanderhye, P.C.
主权项 1. A semiconductor memory device, comprising: a memory cell array configured by arranging a plurality of memory cells, each of which includes a variable resistance element for storing information based on a variation in electrical resistance, in a row direction and a column direction, respectively, such that one ends of the memory cells of the same column are connected to a common first control line, and the other ends of the memory cells of at least the same row or the same column are connected to a common second control line; a selection circuit for selecting the memory cell to be written or read; a writing circuit for changing an electrical resistance of the variable resistance element of the selected memory cell; and a reading circuit for reading a resistance state of the variable resistance element of the selected memory cell, wherein the writing circuit is configured to execute each of a setting action in which the electrical resistance of the variable resistance element is converted to a low resistance by applying an electric current from the one end side to the other end side of the memory cell via the variable resistance element, and a resetting action in which the electrical resistance of the variable resistance element is converted to a high resistance by applying an electric current from the other end side to the one end side of the memory cell via the variable resistance element, and the reading circuit is configured to execute each of a first reading action in which the resistance state of the variable resistance element is read by applying an electric current from the one end side to the other end side of the memory cell via the variable resistance element, and a second reading action in which the resistance state of the variable resistance element is read by applying an electric current from the other end side to the one end side of the memory cell via the variable resistance element.
地址 Osaka-shi, Osaka JP