| 发明名称 |
MULTILAYER WIRING BOARD |
| 摘要 |
A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material. |
| 申请公布号 |
US2015136447(A1) |
申请公布日期 |
2015.05.21 |
| 申请号 |
US201314399535 |
申请日期 |
2013.05.09 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Katou Masahiro;Koshikawa Yasuyuki;Wada Hiroshi |
| 分类号 |
H05K1/02;H05K1/11;H05K1/03 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer wiring board comprising:
a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer; a prepreg disposed on the strip line of the core material; and a second ground pattern disposed on the prepreg, wherein the insulating layer of the core material is configured to include a high frequency-adaptive base material, and the prepreg is configured to include a general-purpose base material. |
| 地址 |
Tokyo JP |
