发明名称 METHOD AND DEVICE FOR LASER PEENING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and device for laser peening capable of implementing laser peening readily and reliably.SOLUTION: The method and device for laser peening radiates a second laser beam B with a second laser intensity stronger than a first laser intensity and a second pulse width narrower than a first pulse width while radiating a first laser beam A with the first laser intensity and the first pulse width to a surface of an object 16 with, to a part to which the first laser beam A is radiated in the surface of the object.</p>
申请公布号 JP2015093284(A) 申请公布日期 2015.05.18
申请号 JP20130232195 申请日期 2013.11.08
申请人 AISIN SEIKI CO LTD 发明人 HAYASHI TAKAYUKI;HIEJIMA HIROYOSHI;OTA MICHIHARU;OKAMOTO AKIHIRO;OKAZAKI AKIRA
分类号 B23K26/352;B23K26/00;B23K26/06;B23K26/08;C21D7/06 主分类号 B23K26/352
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