发明名称 |
METHOD AND DEVICE FOR LASER PEENING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for laser peening capable of implementing laser peening readily and reliably.SOLUTION: The method and device for laser peening radiates a second laser beam B with a second laser intensity stronger than a first laser intensity and a second pulse width narrower than a first pulse width while radiating a first laser beam A with the first laser intensity and the first pulse width to a surface of an object 16 with, to a part to which the first laser beam A is radiated in the surface of the object.</p> |
申请公布号 |
JP2015093284(A) |
申请公布日期 |
2015.05.18 |
申请号 |
JP20130232195 |
申请日期 |
2013.11.08 |
申请人 |
AISIN SEIKI CO LTD |
发明人 |
HAYASHI TAKAYUKI;HIEJIMA HIROYOSHI;OTA MICHIHARU;OKAMOTO AKIHIRO;OKAZAKI AKIRA |
分类号 |
B23K26/352;B23K26/00;B23K26/06;B23K26/08;C21D7/06 |
主分类号 |
B23K26/352 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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