发明名称 COOLER AND ELECTRONIC APPARATUS MOUNTING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To prevent dew condensation on the outer surface of a heat radiation path, a heat radiation section and a return path while maintaining the cooling efficiency, in a cooler and an electronic apparatus mounting the same.SOLUTION: A heat radiation section 4 is installed in a water cooling system apparatus 51 in contact with a water-cooled heat sink 7, a heat radiation path 5 and a return path 6 penetrate the housing 52 of an electronic apparatus 50, and the housing 53 of a water cooling system apparatus 51 and connect a heat receiving section 3 and the heat radiation section 4. A bypass channel 11 connecting a supply channel 9 and a discharge channel 10 in a water cooling system apparatus 51 on the outside of the water-cooled heat sink 7, and a solenoid valve 12 for controlling the passing water to the water-cooled heat sink 7 are provided. Furthermore, a temperature sensor 14 for detecting the temperature of refrigerant, a temperature sensor 15 for detecting the atmospheric temperature, and a control unit 13 for controlling the solenoid valve 12 by the temperatures detected by respective temperature sensors 14, 15 are provided.</p>
申请公布号 JP2015095614(A) 申请公布日期 2015.05.18
申请号 JP20130235673 申请日期 2013.11.14
申请人 PANASONIC IP MANAGEMENT CORP 发明人 KATSUMI YOSHIMASA;SUGIYAMA MAKOTO
分类号 H01L23/427;H05K7/20 主分类号 H01L23/427
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