发明名称 INSPECTION METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To allow for easy examination whether or not the composition of the surface of a film is in normal state.SOLUTION: At first, a test object is prepared (step S20). The test object has a substrate SUB, and a first film FL1 formed on the substrate SUB. TDS is then performed while raising the temperature of the test object to 1000°C or more (step S40), and the propriety of the test object is determined by examining the presence or absence of a peak at 1000°C or more (step S60). The substrate SUB is a semiconductor substrate, e.g., a silicon substrate. The temperature rising rate is 40°C/min-80°C/min. Upper limit of the temperature of the TDS is 1300°C, for example.</p>
申请公布号 JP2015090929(A) 申请公布日期 2015.05.11
申请号 JP20130230363 申请日期 2013.11.06
申请人 RENESAS ELECTRONICS CORP 发明人 CHO SHIEN;HARA TAKAHIRO;ITO KENICHI
分类号 H01L21/66;C23C16/44;H01L21/205;H01L21/336;H01L29/78 主分类号 H01L21/66
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