Light-emitting device package and method of manufacturing the same

摘要

Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad (101); a light-emitting device (104) formed on the heat dissipation pad; a pair of lead frames (102) disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member (107) surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires (106) for electrically connecting the lead frames to the light-emitting device.