发明名称 Method of processing translucent rigid substrate laminate, and process of manufacturing plate-shaped product employing the method
摘要 Provided is a method of processing a translucent rigid substrate laminate, whereby it becomes possible to maintain peeling properties and good appearance of the translucent rigid substrate laminate during the processing of the translucent rigid substrate laminate even when a process such as transportation and storage is included in the method. The method of processing a translucent rigid substrate laminate comprises a step 1 for producing a translucent rigid substrate laminate in which at least two translucent rigid substrates are bonded to each other with a photocurable adhering agent; a step 2 for maintaining the translucent rigid substrate laminate, which has been produced in step 1 or which has been subjected to a shape processing subsequent to step 1, under predetermined temperature management conditions and transporting and/or storing the translucent rigid substrate laminate while maintaining the translucent rigid substrate laminate under the above-mentioned conditions; and a step 3 for peeling the translucent rigid substrate laminate which has been subjected to the shape processing or has not been subjected to the shape processing subsequent to step 2.
申请公布号 US9023173(B2) 申请公布日期 2015.05.05
申请号 US201113990212 申请日期 2011.11.25
申请人 Denki Kagaku Kogyo Kabushiki Kaisha 发明人 Kurimura Hiroyuki;Miyazaki Hayato
分类号 B32B37/12;B32B7/12;C08L75/16;C08G18/67;C08G18/75;B32B17/10 主分类号 B32B37/12
代理机构 Stein IP, LLC 代理人 Stein IP, LLC
主权项 1. A method of processing a translucent rigid substrate laminate comprising: a step 1 for producing a translucent rigid substrate laminate in which at least two translucent rigid substrates are bonded to each other with a photocurable adhering agent; a step 2 for maintaining the translucent rigid substrate laminate, which has been produced in step 1 or which has been subjected to shape processing subsequent to step 1, under the following temperature management conditions and transporting and/or storing the translucent rigid substrate laminate while maintaining the translucent rigid substrate laminate under the conditions of 1) 10 hours to 4 weeks when the translucent rigid substrate laminate is maintained at a management temperature lower than a glass transition temperature of a cured body of the photocurable adhering agent by 0° C. or more and less than 5° C.,2) 10 hours to 6 weeks when the translucent rigid substrate laminate is maintained at a management temperature lower than the glass transition temperature of a cured body of the photocurable adhering agent by 5° C. or more and less than 10° C., and3) 10 hours to 8 weeks when the translucent rigid substrate laminate is maintained at a management temperature lower than a glass transition temperature of a cured body of the photocurable adhering agent by 10° C. or more; anda step 3 for peeling the translucent rigid substrate laminate which has been subjected to the shape processing or has not been subjected to the shape processing subsequent to step 2.
地址 Tokyo JP