| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a metal block solder bonded to one surface of a semiconductor chip, which can reduce stress acting on the solder bonded part of the semiconductor chip with a simple structure. <P>SOLUTION: A metal block 13 is bonded to a top face of a semiconductor chip 12 by a solder 17, and metal heat radiation plates 14, 15 are bonded to a top face of the metal block and an undersurface of the semiconductor chip by solders 17, respectively, and those components are molded by a mold resin layer 16. The metal block 13 is formed of a thin truncated quadrangular pyramid in which an angle θ of a portion of a sidewall part erecting from a surface of the semiconductor chip 12 is set at an acute angle within a range from 45° to less than 90°. <P>COPYRIGHT: (C)2012,JPO&INPIT |
