| 发明名称 | Vent hole sealing in multiple die sensor device | ||
| 摘要 | Embodiments of methods of fabricating a sensor device include attaching first and second die to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively. The second die has an opening in communication with the second cavity. The methods further include obstructing the opening, attaching a third die to the second die. The first cavity is hermetically sealed by attaching the first and second die. The second cavity is hermetically sealed by attaching the third die to the second die. | ||
| 申请公布号 | US9018029(B1) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201314099502 | 申请日期 | 2013.12.06 |
| 申请人 | Freescale Semiconductor, Inc. | 发明人 | Bowles Philip H.;Holm Paige M.;Hooper Stephen R.;Liu Lianjun;Roop Raymond M. |
| 分类号 | B81B7/02;B81C1/00 | 主分类号 | B81B7/02 |
| 代理机构 | Lempia Summerfield Katz LLC | 代理人 | Lempia Summerfield Katz LLC |
| 主权项 | 1. A method of fabricating a sensor device, the method comprising: attaching first and second die to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively, the second die having an opening in communication with the second cavity; obstructing the opening; and attaching a third die to the second die; wherein the first cavity is hermetically sealed by attaching the first and second die; and wherein the second cavity is hermetically sealed by attaching the third die to the second die. | ||
| 地址 | Austin TX US | ||