Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed.
申请公布号
WO2015057216(A1)
申请公布日期
2015.04.23
申请号
WO2013US65246
申请日期
2013.10.16
申请人
INTEL CORPORATION;ZHANG, QINGLEI;LOTZ, STEFANIE M.