LASER ETCHING APPARATUS AND METHOD

摘要

Disclosed is a laser etching apparatus and a method thereof. The laser etching apparatus according to one embodiment of the present invention, comprises: a vacuum chamber in which an etching process for a substrate chucked on an upper surface of a chucking module is prosecuted; a laser irradiator for irradiating a laser in order to etch organic matters deposited in an outer part of the substrate; and a rotary module body which is connected to the chucking module and rotates the chucking module by a predetermined angle to prevent an organic matter particle separated from the substrate during an etching process by the laser from being re-deposited on the substrate.