发明名称 DIE BONDER AND ADHESIVE COATING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a die bonder which has, for example, at least two preform heads (PH) to shorten the drawing time and allows the reduction of vibration of a device due to operation of two PHs, and to provide an adhesive coating method.SOLUTION: A first preform part for applying an adhesive to a first coating area out of the first coating area and a second coating area into which a coating area of the adhesive is divided, and a second preform part for applying the adhesive to the second coating area are provided. When the first preform part is moved in directions along an X axis a Y axis to apply the adhesive in order to apply the adhesive to the coating area, the second preform part is moved in directions opposite to directions in which the first preform part is moved along the X axis and the Y axis, for the same distance as the first preform part simultaneously with movement of the first preform part in order to apply the adhesive to the second coating area.</p>
申请公布号 JP2015076409(A) 申请公布日期 2015.04.20
申请号 JP20130209326 申请日期 2013.10.04
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 MOCHIZUKI MASAYUKI;IDE KIRITO;YODA MITSUHISA
分类号 H01L21/52 主分类号 H01L21/52
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